Remtec is
dedicated to using its wide-ranging equipment base, modern
manufacturing techniques and diverse industry experience to solve your
microelectronic packaging problems. Our technical personnel are well
prepared to use their broad materials expertise to meet your packaging
and assembly needs. Utilizing the latest CAD tools, Remtec engineers
work closely with you to develop the most cost-effective manufacturing
techniques for your specific requirements.
Our 30,000 sq. ft.
facility, equipped with state-of-the-art thick film processing and
electroplating equipment, is designed to maximize throughput and to
offer you the advantages of mass production.
With years of
experience in volume manufacturing, Remtec has refined its patented
process that combines plated copper images with thick film on ceramic
substrates. This technology, Plated Copper on Thick Film (PCTF®),
allows Remtec to achieve product uniformity, yield consistency,
remarkably high reliability and product performance levels well within
customer expectations.
Notably, Remtec
products, with over 100 milllion gold and aluminum wire bond
connections and over 1 billion solder joint connections, have been
successfully tested in numerous industries without reported field
failures.
At Remtec, we turn
your packaging and assembly problems into effective, reliable and
lasting solutions.
 
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A
class 10,000 clean room, our printing operation has the capacity
of producing
more than 50,000 metalized substrates per month using both
semiautomatic and fully automated cassette-to-cassette equipment.
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Four thick film production furnaces including
robotic cassette-to-cassette loaders and unloaders provide
optimum throughput and support for our screen-printing operations.
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In house high speed laser trim and test
system provides for fast turn around and ensures product
reliability. |
| Remtec's application engineers and designers work
closely with our customers selecting the most cost-effective
design and manufacturing techniques for both prototype and
high volume production. |
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An on-site analytic laboratory ensures tight
plating control and allow the finite adjustments that assure
process uniformility for all electroplating and
autocatalytic plating operations. |
| Remtec's x-ray fluorescence system is used to
verify the thickness plated metals in a broad range with great
accuracy. |
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To ensure top quality, all products are subjected
to rigorous inspection and testing using a variety of precision
measurement equipment and statistical process control. |
| A modern plating facility houses several new,
state-of-the-art electroplating and autocatalytic plating lines,
adding to the variety of surface finishes. |
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In house SMT reflow soldering,
gold and aluminum wire bonding and high temperature brazing capabilities
allow Remtec to perform product assembly and testing on PCTF
substrates and packages. |
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