1. Can REMTEC fabricate Plugged Vias with gold?

Yes, we can. Although we normally produce silver based vias with copper plating and nickel gold finish. That is what we do for most of our customers, which is economical and reliable and thermally conductive. However, we also produce gold via fill for customers, which specify gold as a material of choice.


2. Does your process capability include printed resistors? If so, what are the standard ohm/square data?

Yes. From 100 milliohm/square to 1 megohm/square.

3. What is the smallest resistor REMTEC can print?

. 010” x .010” or smaller

4. Is REMTEC capable of trimming the resistors?

Yes. We have a high-speed laser trim system.

5. Is PCTF technology suitable for high frequency applications?

Our PCTF technology has been proven viable up to 26 GHz with thick films option and to 40 GHz with thin film combination

6. Can your design incorporate cut outs or machining of ceramic?

Yes.


7. What are standard dimensions of 0.6mm thickness Alumna substrate panels m REMTEC deals with?

6.5” x 4.5”, 4.5”x4.5”, 5”x7” and many others.


8. What are general design rules?  (Minimum trace width, minimum trace separation, etc)?

. 005”/.005” for unplated thick films (or .004”/.004” depending on circuit complexity and plate size) and .010”/.007” for plated thick films. (also see attached design guidelines).


9. What are the RF characteristics of the Alumna that can be used as a reference? (Dielectric permeability, loss tangent, etc)

Dielectric Constant is 9.5 and Loss Tangent is about .0004 (please refer to standard data for 96% alumina ceramic of COORS, Kyocera or Ceramtec.

10. What is the file formats that we should supply to you. (Gerber, etc.)

dwg, dxf


11: What is the standard lead time?

Four weeks for prototypes from receipt of approved artwork, and after receipt of order (ARO). The production lead-time depends on a number of factors, but normally is 6 weeks for the first production run and shorter for routine repeat orders.

 

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