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Press
Releases
November 7 2007
Remtec Introduces Submounts with Zero Pullback™ Metallization for High Power Laser Diodes
January 10 2007
Remtec’s New Fine-Line Capability
January 2 2007
DOLLMAN JOINS REMTEC MANAGEMENT TEAM
June 10 2006
Remtec Introduces Hermetic, Leadless Ceramic SMT Packages for Direct PCB Mount
May 12 2006
Remtec’s Large Size Leadless SMT Ceramic Packages for Direct PCB Mount Provide Reliable, Low Cost Interconnects in a Broad Frequency Range.
April 24 2006
Remtec Announces RoHS Compliance and IS0 9001:2000 Registration
December 29 2005
Remtec Develops Proprietary Process To Produce RoHS Compliant, Low Cost Metalized Ceramic (LCMC) Substrates Not Containing High Cost Palladium
October 25 2004
Remtec Adds New Product Line of Metalized Ceramic Substrates, Chip Carriers And Packages with PCTF Copper Metalization on Aluminum Nitride.
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