Press Releases

November 7 2007

Remtec Introduces Submounts with Zero Pullback™ Metallization for High Power Laser Diodes

January 10 2007

Remtec’s New Fine-Line Capability

January 2 2007

DOLLMAN JOINS REMTEC MANAGEMENT TEAM

June 10 2006

Remtec Introduces Hermetic, Leadless Ceramic SMT Packages for Direct PCB Mount

May 12 2006

Remtec’s Large Size Leadless SMT Ceramic Packages for Direct PCB Mount Provide Reliable, Low Cost Interconnects in a Broad Frequency Range.

April 24 2006

Remtec Announces RoHS Compliance and IS0 9001:2000 Registration

December 29 2005

Remtec Develops Proprietary Process To Produce RoHS Compliant, Low Cost Metalized Ceramic (LCMC) Substrates Not Containing High Cost Palladium

October 25 2004

Remtec Adds New Product Line of Metalized Ceramic Substrates, Chip Carriers And Packages with PCTF Copper Metalization on Aluminum Nitride.