Press Releases

March 21 2010

Twenty Years of Technological Development Position Remtec as Leader in Metalized Ceramic Substrates and Packages

October 1 2009

Remtec Has Deleloped a Custom Line of Power Hermetic SMT Packages for Military, Aerospace and High End Industrial Applications

May 5 2009

Remtec and Microwave Packaging Technology From Strategic Alliance to Design, Manufacture, and Market Complete Packaging Solutions for Microwave and Multimeter-Wave Components and Modules

January 9 2009

Remtec Adds Cost-effective Gold Tin Finish to its Zero Pullback™ Metallization
for High Power Laser Diodes

November 7 2007

Remtec Introduces Submounts with Zero Pullback™ Metallization for High Power Laser Diodes

January 10 2007

Remtec’s New Fine-Line Capability

June 10 2006

Remtec Introduces Hermetic, Leadless Ceramic SMT Packages for Direct PCB Mount

May 12 2006

Remtec’s Large Size Leadless SMT Ceramic Packages for Direct PCB Mount Provide Reliable, Low Cost Interconnects in a Broad Frequency Range.

April 24 2006

Remtec Announces RoHS Compliance and IS0 9001:2000 Registration

December 29 2005

Remtec Develops Proprietary Process To Produce RoHS Compliant, Low Cost Metalized Ceramic (LCMC) Substrates Not Containing High Cost Palladium

October 25 2004

Remtec Adds New Product Line of Metalized Ceramic Substrates, Chip Carriers And Packages with PCTF Copper Metalization on Aluminum Nitride.