PCTF ^® Application & Solutions

Customers from various industries select PCTF technology as a technology of choice for design and fabrication of custom made, high performance, cost effective microelectronic packaging.

Remtec’s technology is versatile and easily adjustable for the specific needs of customers from different industries. Plated Copper on Thick Film (PCTF^®) technology allows designers to complement plated copper tracks and thermal vias with thick film multi-layer circuitry, including printed resistors, capacitors and fine line gold.  Thus. PCTF enables high integration level and miniaturization combining DC power, RF circuitry and integrated passive components on the same substrate.

With the ability to effectively dissipate heat and accommodate advanced assembly methods, PCTF^® technology provides an ideal solution for electronic packaging and assembly. The most typical applications are assembly of surface mount components (especially power SMC), chip-on-board (COB) applications and chip scale packages (chip carriers, flip chips, BGA). Additional applications include SMT multichip modules (MCM), chip carriers and packages for direct pc board mount as well as hermetic power packages integrating multiplayer substrate with plated copper and hermetic vias into a package base (ISP, or Integral Substrate Packages).

Operating at a wide frequency range (DC to over 20 GHz) and successfully meeting the growing thermal management demands, PCTF technology provides a ceramic packaging solution for a broad range of industries: power electronics, RF / Microwave circuitry, optoelectronics and industrial controls. It covers both high reliability military and aerospace applications and commercial and industrial electronics.

Metalized ceramic substrates, chip carriers and packages are commonly used in telecommunications, sensors, wireless and fiberoptic data transfer devices, biomedical instrumentation, power supplies and optoelectronics. Typical applications include high density DC/DC converters and power modules, RF and microwave modules, RF power amplifiers, RF power supplies, TR modules, filters, optical switches, chip carriers for Si and GaAs IC’s and other electronic assemblies.

  Industry Served:

Telecommunications	RF/Microwave Applications	Power Electronics
BioMed-Instrumentations & Sensors	Semiconductor & Optoelectronic	Military & Aerospace

Click here to see our Plating Capabilities

 

   Application Examples:

Telecommunications
	SMT Chip Carriers & Leadless Packages for direct pcb mount (click here for more info) MMIC Carriers LNA RF Power Amplifiers

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RF / Microwave
	DC/DC Converters Motor Controllers Flanged Power Resistors Power Chip Resistors IGBT TEC

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Power Electronics
	DC/DC Converters Motor Controllers Flanged Power Resistors Power Chip Resistors IGBT TEC

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Biomedical, Instrumentations & Sensors
	Gas Analyzers Thermal Sensors IR detectors LR and LC carriers Galvanometers Hearing Aids

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TEC
	Miniature Coolers Multilayer Coolers  Ultra thin substrates Alumina, BeO and AlN substrates

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Semiconductor & Optoelectronics
	Chip Carriers for direct pcb mount Submounts RF Power Supplies High Power resistors

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Military & Space
	ISP Integral Substrate Packages TR Modules PIN Diode Assemblies

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Plating & Plating Capabilities
	Plating Cu, Ni, Au, Ag, Sn  on Alumina, BeO, AlN, glass and quartz Plating Cu, Ni & Au on LTCC Plating on Bi-Te Crystals for TEC Plating on Cu-W, Cu-Be and other composites and metals Plating Cu, Ni & Au on wafers

 

Assembly Capabilities
	• SMT Assembly: solder pasting,     refllow soldering fully ROHS     compliant • Die Attach • Au and Al gold wire bonding • High temperature brazing     including flanged resistors and     pin assembly • Hermetic packages assembly • Testing

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