Thermal
management improvement:
Using
plated copper metalization from .001” to .010”
thick, on a thermally conductive base as thin as
.010”, with thermal vias (K=200W/°CxM),
plated through holes and plated-up heat spreaders
and low thermal resistance (Řjc below 2°C/W),
designers can achieve a degree of heat dissipation
not previously possible at the commercial level.
Designers
can increase circuit density in a miniaturized
package:
Using
Remtec’s PCTF® technology, designers can combine fine lines
(.002”) and thick copper plated wires (.010” in
diameter). In addition, thick film multi-layer
patterns (up to four layers per side), small size printed
thick film resistors (smaller than .010” X
.010”) and inductors contribute to maximum
performance in a miniaturized package.
PCTF
®
circuitry operates at a wide frequency range:
Remtec’s
metalized ceramic substrates have been successfully
field-tested to frequencies exceeding 24 GHz with
low losses, often replacing costly thin
film circuits without sacrificing performance.
PCTF technology incorporates microstrip lines, fine
lines, resistors and efficient signal and ground
connections.
PCTF
®
circuitry assures high assembly yield:
Remtec’s
metalized substrates, chip carriers and packages are
compatible with advanced electronic assembly
techniques. Our substrates withstand multiple
soldering operations, assure excellent
solderability, exhibit no solder leaching and
are suitable for various interconnect techniques:
SMT, gold and aluminum wire bond, epoxy die-bond,
flip chip technology and high temperature
die-attach.
PCTF
®
circuitry performs reliably in harsh environments:.
Remtec’s
metalized ceramic substrates (fully-assembled)
withstand thermal cycling from -65oC to
150oC (more than 1000 cycles), and can
operate at elevated temperatures up to 200oC.
In addition, Remtec’s substrates have qualified
for space (Class H & K), military and biomedical
applications. Remtec’s products have also
demonstrated superior adhesion, as well as via
integrity and hermeticity.
