Core Technology: Plated
Copper on Thick films (PCTF ®) Technology
REMTEC utilizes a
patented manufacturing process to produce layers of plated copper (up
to .010" thick), allowing high current capacity in excess of 50
Amps as well as excellent heat spreading and low thermal resistance.
Solid metal vias capability ensures significant improvement in thermal
management and electrical performance.
This cost effective technology is extremely versatile. In addition to
its basic copper plated metalization, we offer a complete range of
thick film resistors and thick film gold. PCTF® technology allows you
to complement your high power plated copper tracks with thick film
multilayer circuitry, thus combining power and logic on the same
substrate (SMART POWER).
Tin, Nickel, and Gold (electrolytic & electroless) finishes over
bare copper allow for excellent soldering, wire bonding (aluminum and
gold) and eutectic die attach. The PCTF® substrate
provides an ideal solution for both the assembly of surface mount
components and chip-on-board technology.
Remtec services a broad range of industries from telecommunications
and computers to power supplies, electro-optical, laser and medical
electronics, covering military, industrial and commercial range
applications. Typical applications include RF power amplifiers and
LNA’s, optical switches, LED, filters, high-density DC/DC
converters, driver circuits, thermoelectric coolers, power hybrids,
power modules, smart power, power packages, chip carriers and other
power assemblies.
Typical
PCTF ® Configuration
Basic
PCTF ® Circuit
with added Features
